What is Qualcomm QCC-3001-2-68CSP-TR-00-0?

: Wolfchip Electronics · : Sep 03, 2024 23:09

The Qualcomm QCC-3001-2-68CSP-MT-00-0 is an advanced Bluetooth audio processor designed to deliver high-quality audio and efficient connectivity in a compact, robust package. This device is targeted at modern wireless audio applications, such as Bluetooth earbuds, headphones, and other portable audio devices. Below is a detailed technical specification for the Qualcomm QCC-3001-2-68CSP-MT-00-0:

### Qualcomm QCC-3001-2-68CSP-MT-00-0 Specifications

#### General Description
- Device Type: Bluetooth Audio Processor
- Manufacturer: Qualcomm
- Series: QCC-3001
- Package Type: 68-pin Chip-Scale Package (CSP), offering a compact footprint suitable for high-density PCB applications.

#### Bluetooth Features
- Bluetooth Version: Supports Bluetooth 5.0 or later, providing enhanced performance including improved range, higher data transfer rates, and lower power consumption.
- Bluetooth Profiles Supported:
- A2DP (Advanced Audio Distribution Profile): For high-quality stereo audio streaming.
- AVRCP (Audio/Video Remote Control Profile): For remote control of media playback functions.
- HFP (Hands-Free Profile): For hands-free calling and voice assistant integration.
- HSP (Headset Profile): For audio streaming and microphone support in headsets.
- Supported Audio Codecs:
- aptX: High-definition audio streaming with low latency.
- aptX HD: High-resolution audio streaming for superior sound quality.
- AAC (Advanced Audio Codec): Efficient audio compression with high quality.
- SBC (Subband Coding): A mandatory codec for Bluetooth audio with a balance of quality and data rate.

#### Audio Processing Features
- Digital Signal Processing (DSP): Advanced DSP capabilities for superior audio performance, including:
- Noise Cancellation: Reduces background noise to enhance audio clarity.
- Echo Cancellation: Mitigates echo during voice communications.
- Audio Enhancement: Improves audio quality through various algorithms.
- Sampling Rates: Supports high sampling rates, accommodating various audio formats and ensuring high-fidelity sound reproduction.

#### Connectivity and Interfaces
- I/O Interfaces:
- I2S (Inter-IC Sound): For transmitting high-quality audio data.
- SPI (Serial Peripheral Interface): For fast serial data communication.
- I2C (Inter-Integrated Circuit): Used for configuration and communication with peripheral devices.
- UART (Universal Asynchronous Receiver-Transmitter): For serial communication with external systems.
- Power Management: Advanced power management features to optimize energy use and extend battery life in portable devices. Includes power-saving modes and efficient power design.

#### Performance Characteristics
- Processing Power: High-performance processing core capable of handling complex audio tasks, including real-time processing of multiple audio streams.
- Memory: Ample on-chip memory to support audio processing algorithms, user settings, and other data.

#### Physical Characteristics
- Package Size: Housed in a 68-pin Chip-Scale Package (CSP), offering a compact and space-efficient solution for modern electronic designs.
- Mounting Type: Utilizes surface-mount technology (SMT) for integration into high-density printed circuit boards (PCBs).

#### Application Areas
- Wireless Audio Devices: Ideal for Bluetooth earbuds, headphones, and speakers requiring high-quality audio processing and reliable connectivity.
- Consumer Electronics: Suitable for smartphones, tablets, and other devices that require advanced Bluetooth audio features.
- Automotive and Industrial Applications: Can be used in automotive infotainment systems and industrial devices needing robust Bluetooth audio solutions.

#### Additional Notes
- Temperature Range: Designed to operate within a specific temperature range to ensure reliable performance in various environmental conditions.
- Compliance: Meets industry standards and regulatory requirements, including RoHS, ensuring compliance with safety and environmental regulations.

For a comprehensive understanding of the QCC-3001-2-68CSP-MT-00-0’s electrical characteristics, pin configurations, and integration guidelines, refer to the Qualcomm datasheet. This datasheet provides detailed information on the device’s specifications, performance metrics, and design recommendations essential for effective application in electronic systems.

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