What is Qualcomm QCC-3004-1-68CSP-TR-00-0?

: Wolfchip Electronics · : Sep 03, 2024 23:09

The Qualcomm QCC-3004-1-68CSP-TR-00-0 is a Bluetooth audio System on Chip (SoC) engineered for advanced wireless audio applications. Here are the detailed technical specifications:

### General Overview:
- Product Type: Bluetooth Audio SoC
- Model Number: QCC-3004-1
- Package Type: 68-ball Chip Scale Package (CSP)
- Packaging Format: Tape-and-Reel (TR)
- Application: Designed for high-performance Bluetooth audio devices such as wireless earbuds, headphones, and other audio streaming equipment.

### Technical Specifications:

1. Bluetooth Version:
- Support: Bluetooth 5.2
- Features: Includes enhanced features such as high-speed data transfer, low energy operation, and support for improved audio codecs and reduced latency.

2. Audio Processing:
- Processor: Equipped with a low-power ARM Cortex-M4 processor
- DSPs: Multiple Digital Signal Processors (DSPs) for advanced real-time audio processing
- Supported Codecs: High-definition audio codecs including aptX Adaptive, AAC, and SBC
- Audio Quality: Capable of high-resolution audio playback with low latency and high fidelity.

3. Power Management:
- Low Power Consumption: Engineered for optimal battery life in portable and wireless audio devices.
- Energy Efficiency: Incorporates advanced techniques to reduce power usage while maintaining high performance.

4. Connectivity and Integration:
- Interfaces: Supports a variety of audio and control interfaces for versatile integration with different hardware components.
- Bluetooth Transceiver: Integrated transceiver for stable and efficient wireless communication.
- Peripheral Compatibility: Designed to interface with external sensors and components typically used in Bluetooth audio applications.

5. Physical Package:
- Package Type: 68-ball Chip Scale Package (CSP)
- CSP Details: Provides a compact and robust packaging solution with minimized size and high thermal performance, ideal for space-constrained applications.
- Package Size: Compact footprint suitable for modern, densely packed electronic devices.

6. Packaging Format:
- Tape-and-Reel (TR): Designed for efficient automated assembly, making it suitable for large-scale manufacturing processes.

### Applications:
- Consumer Electronics: Suitable for use in wireless earbuds, Bluetooth headphones, smart speakers, and other Bluetooth-enabled audio devices.
- Professional Audio: Can be used in high-fidelity audio devices that demand high-quality sound and reliable wireless performance.

### Additional Features:
- Enhanced Bluetooth Connectivity: Improved range and stability for a better wireless audio experience.
- Audio Processing Features: Advanced audio processing capabilities for superior sound quality and clarity.

The Qualcomm QCC-3004-1-68CSP-TR-00-0 SoC is a versatile solution, providing advanced Bluetooth audio capabilities with a focus on high performance and energy efficiency, tailored for high-end wireless audio devices.

Wolfchip Electronics Limited | https://www.wolfchip.com/blog/what-is-qualcomm-qcc-3004-1-68csp-tr-00-0.html