What is Qualcomm QCC-3006-0-68CMQFN-TR-00-0?

: Wolfchip Electronics · : Sep 03, 2024 23:09

The Qualcomm QCC-3006-0-68CMQFN-TR-00-0 is a Bluetooth audio System on Chip (SoC) designed for advanced wireless audio applications. Here are the detailed technical specifications:

### General Overview:
- Product Type: Bluetooth Audio SoC
- Model Number: QCC-3006-0
- Package Type: 68-pin Chip-on-Board (COB) Quad Flat No-Lead (QFN) Package
- Packaging Format: Tape-and-Reel (TR)
- Application: Optimized for high-performance wireless audio devices, including headphones, earbuds, and other Bluetooth-enabled audio equipment.

### Technical Specifications:

1. Bluetooth Version:
- Support: Bluetooth 5.4
- Features: Supports the latest Bluetooth technology for improved data transfer rates, extended range, and better energy efficiency. Includes advanced Bluetooth profiles for high-quality audio streaming and low-latency communication.

2. Audio Processing:
- Processor: Integrated low-power ARM Cortex-M33 processor for efficient audio and control processing.
- DSPs: Multiple advanced Digital Signal Processors (DSPs) for real-time audio processing, supporting high-resolution audio and sophisticated sound enhancements.
- Supported Codecs: Supports high-definition audio codecs such as aptX Adaptive, AAC, and SBC for superior audio quality and minimal latency.

3. Power Management:
- Low Power Consumption: Designed with power efficiency in mind to extend battery life in portable audio devices.
- Energy Efficiency: Utilizes advanced power management techniques to balance performance with battery longevity.

4. Connectivity and Integration:
- Interfaces: Offers a variety of audio and control interfaces for versatile integration with various hardware components.
- Bluetooth Transceiver: Integrated transceiver for stable and efficient wireless communication.
- Peripheral Support: Compatible with a range of external sensors and components, enhancing functionality in Bluetooth audio devices.

5. Physical Package:
- Package Type: 68-pin Chip-on-Board (COB) Quad Flat No-Lead (QFN) Package
- QFN Details: Provides a compact and thermally efficient packaging solution with a reduced footprint, ideal for modern, high-density electronic designs.
- Dimensions: Compact size suitable for integration into space-constrained applications.

6. Packaging Format:
- Tape-and-Reel (TR): Facilitates automated assembly and handling, making it suitable for high-volume production environments.

### Applications:
- Consumer Electronics: Perfect for premium wireless earbuds, Bluetooth headphones, smart speakers, and other advanced audio devices.
- Professional Audio: Suitable for high-fidelity audio products requiring high-quality sound and reliable wireless connectivity.

### Additional Features:
- Enhanced Bluetooth Connectivity: Improved range and connection stability for a seamless user experience.
- Advanced Audio Capabilities: High-resolution audio support and sophisticated audio processing for exceptional sound fidelity and low-latency performance.

The Qualcomm QCC-3006-0-68CMQFN-TR-00-0 SoC provides a comprehensive solution for high-end Bluetooth audio applications, combining advanced processing power, efficient power management, and robust wireless connectivity in a compact and versatile package.

Wolfchip Electronics Limited | https://www.wolfchip.com/blog/what-is-qualcomm-qcc-3006-0-68cmqfn-tr-00-0.html