What is Qualcomm QCC-3007-0-68CMQFN-TR-00-0?

: Wolfchip Electronics · : Sep 03, 2024 23:09

The Qualcomm QCC-3007-0-68CMQFN-TR-00-0 is a Bluetooth audio System on Chip (SoC) designed to deliver high-quality audio performance in advanced wireless audio devices. Here are the detailed technical specifications:

### General Overview:
- Product Type: Bluetooth Audio SoC
- Model Number: QCC-3007-0
- Package Type: 68-pin Chip-on-Board (COB) Quad Flat No-Lead (QFN) Package
- Packaging Format: Tape-and-Reel (TR)
- Application: Engineered for high-performance audio applications, including wireless earbuds, headphones, and other Bluetooth-enabled audio devices.

### Technical Specifications:

1. Bluetooth Version:
- Support: Bluetooth 5.4
- Features: Provides the latest Bluetooth technology enhancements including faster data transfer rates, extended range, and better energy efficiency. Supports advanced Bluetooth profiles and protocols for superior audio streaming and connectivity.

2. Audio Processing:
- Processor: Integrated low-power ARM Cortex-M33 processor, designed for efficient audio and control processing with low power consumption.
- DSPs: Multiple advanced Digital Signal Processors (DSPs) integrated for high-resolution audio processing, real-time audio enhancements, and support for complex audio algorithms.
- Supported Codecs: High-definition audio codec support including aptX Adaptive, AAC, and SBC, ensuring high-quality audio playback with minimal latency.

3. Power Management:
- Low Power Consumption: Optimized to maximize battery life in portable devices by minimizing power usage.
- Energy Efficiency: Incorporates advanced power-saving technologies to enhance overall energy efficiency while maintaining high performance.

4. Connectivity and Integration:
- Interfaces: Provides a range of audio and control interfaces to support flexible integration with various hardware components.
- Bluetooth Transceiver: Integrated transceiver for reliable and efficient wireless communication.
- Peripheral Support: Compatible with a variety of external sensors and components to expand functionality and enhance user experience.

5. Physical Package:
- Package Type: 68-pin Chip-on-Board (COB) Quad Flat No-Lead (QFN) Package
- QFN Details: Features a compact, thermally efficient packaging solution with a low profile, making it suitable for modern electronic designs with space constraints.
- Package Size: Designed to fit within tight spaces on high-density PCBs, ensuring compatibility with compact device designs.

6. Packaging Format:
- Tape-and-Reel (TR): Facilitates automated handling and assembly processes, ideal for high-volume manufacturing.

### Applications:
- Consumer Electronics: Perfect for high-end wireless earbuds, Bluetooth headphones, smart speakers, and other advanced Bluetooth audio devices.
- Professional Audio: Suitable for premium audio equipment requiring high-fidelity sound quality and reliable wireless performance.

### Additional Features:
- Enhanced Connectivity: Improved Bluetooth range and stability for a more seamless audio experience.
- Advanced Audio Capabilities: High-resolution audio support and sophisticated audio processing for superior sound fidelity, clarity, and low-latency performance.

The Qualcomm QCC-3007-0-68CMQFN-TR-00-0 SoC offers a comprehensive solution for premium Bluetooth audio devices, integrating advanced processing capabilities, efficient power management, and robust connectivity in a compact and efficient package.

Wolfchip Electronics Limited | https://www.wolfchip.com/blog/what-is-qualcomm-qcc-3007-0-68cmqfn-tr-00-0.html