SB520

Obsolete - DIODE SCHOTTKY 20V 5A DO201AD
Description:
DIODE SCHOTTKY 20V 5A DO201AD
SB520 Specification
Product Attribute
Attribute Value
Packaging
Tape & Reel (TR)
Voltage - DC Reverse (Vr) (Max)
20 V
Current - Average Rectified (Io)
5A
Voltage - Forward (Vf) (Max) @ If
550 mV @ 5 A
Speed
Fast Recovery = 200mA (Io)
Reverse Recovery Time (trr)
-
Current - Reverse Leakage @ Vr
500 μA @ 20 V
Capacitance @ Vr, F
500pF @ 4V, 1MHz
Mounting Type
Through Hole
Package / Case
DO-201AD, Axial
Supplier Device Package
DO-201AD
Operating Temperature - Junction
-55 ℃ ~ 150 ℃
SB520 Description
The onsemi SB520 is a high-voltage, high-current Schottky barrier diode designed for power rectification and switching applications. It provides low forward voltage drop, fast switching speeds, and high efficiency, making it suitable for switching power supplies, freewheeling diodes, and low-loss rectification in industrial, automotive, and consumer electronics. The device combines robust voltage handling with low reverse leakage current, ensuring reliable performance in high-temperature environments and high-frequency circuits. Its Schottky junction technology minimizes conduction losses and improves overall power conversion efficiency.
## Device Architecture and Package
The SB520 is a discrete silicon Schottky diode constructed with a planar metal-semiconductor junction optimized for low forward voltage drop and fast recovery characteristics. Key architectural features include:
* Metal-silicon junction forming the Schottky barrier, allowing rapid charge carrier movement and minimizing stored charge.
* Optimized anode and cathode metallization to reduce series resistance and thermal gradients.
* High thermal stability of the junction to maintain low leakage and consistent forward voltage across industrial temperature ranges.
The device is offered in a DO-214AB (SMA) surface-mount package with low thermal resistance and high mechanical reliability. The package supports automated assembly, robust soldering, and effective heat dissipation via PCB copper pads.
## Electrical Specifications
Reverse Voltage (VR): Maximum 20 V, allowing operation in low- to moderate-voltage power rectification applications.
Forward Current (IF): Maximum continuous forward current of 5 A at TA = 25°C with adequate heatsinking, suitable for high-current rectification in power supplies and converters.
Forward Voltage Drop (VF): Typical 0.55 V at IF = 3 A, minimizing conduction losses in high-efficiency circuits.
Reverse Leakage Current (IR): Typical 0.5 mA at VR = 20 V and TA = 25°C; maximum 5 mA at TA = 125°C, ensuring low standby power dissipation.
Junction Capacitance (Cj): Typical 200 pF at VR = 4 V, supporting high-speed switching and low distortion in fast-switching circuits.
Surge Current (IFSM): Maximum 150 A for a 10 ms half-sine wave pulse, providing robustness against transient overloads in rectifier applications.
Thermal Resistance, Junction-to-Ambient (RθJA): Approximately 75°C/W on a standard PCB without additional copper, enabling efficient heat management with proper layout.
Operating Temperature: -65°C to +150°C, suitable for automotive, industrial, and consumer electronic environments.
Storage Temperature: -65°C to +175°C, ensuring robust handling and storage reliability.
Reverse Recovery Time (trr): Extremely fast due to Schottky junction, typically less than 10 ns, minimizing switching losses in high-frequency applications.
## Functional Features
Low Forward Voltage Drop: Minimizes conduction losses, improving efficiency in rectification and power conversion applications.
Fast Switching Speed: Schottky barrier design provides sub-10 ns reverse recovery, making the diode suitable for high-frequency switching power supplies.
High Surge Capability: Capable of handling short-duration surge currents without degradation, ensuring robustness under transient load conditions.
Low Leakage Current: Ensures minimal standby power loss and predictable behavior in reverse-biased conditions.
Compact Surface-Mount Package: DO-214AB (SMA) package provides ease of assembly, low parasitic inductance, and reliable mechanical performance.
Thermal Performance: Effective heat dissipation through PCB copper pads supports stable operation under continuous high-current conditions.
## Timing and Performance Characteristics
Reverse Recovery: The Schottky junction inherently avoids minority carrier storage, resulting in negligible reverse recovery time and minimal switching losses.
Dynamic Resistance: Low series resistance contributes to low forward voltage drop and reduced power dissipation during conduction.
Temperature Dependence: VF decreases slightly with temperature rise, while IR increases exponentially, highlighting the importance of thermal management in high-temperature applications.
High-Frequency Behavior: Low junction capacitance and fast switching enable efficient operation in switch-mode power supplies up to hundreds of kHz or low MHz frequency ranges.
## Applications
The SB520 is optimized for applications requiring fast, low-loss rectification:
* Switching power supplies for industrial and consumer electronics.
* Freewheeling diodes in motor drives and inductive load circuits.
* Low-voltage, high-current rectification in DC-DC converters.
* Automotive electronics, including battery management and power distribution systems.
* High-efficiency power modules where fast recovery and low forward voltage are critical.
Its combination of high surge capability, low forward voltage, and fast switching makes it a versatile solution for high-current rectification in demanding electronic designs.
## Reliability and Compliance
Manufactured under onsemi’s quality and reliability standards, the SB520 provides stable operation over the industrial temperature range with high mechanical and thermal robustness. The DO-214AB package supports automated assembly and ensures consistent solder joint integrity. RoHS compliant and lead-free, the diode is suitable for environmentally conscious manufacturing. The device’s Schottky architecture, high surge tolerance, and low power dissipation contribute to long-term reliability in power conversion, automotive, and industrial systems, maintaining performance under both steady-state and transient operating conditions.