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Home  /  Integrated Circuits (ICs)  /  Memory  /  Samsung Semiconductor K4F8E304HB-MGCJ

K4F8E304HB-MGCJ

Active Icon Active - LPDDR4 8Gb x32 3733 Mbps 1.1v 20
K4F8E304HB-MGCJ
K4F8E304HB-MGCJ
Samsung Semiconductor
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LPDDR4 8Gb x32 3733 Mbps 1.1v 20
 
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K4F8E304HB-MGCJ Specification

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K4F8E304HB-MGCJ Description

The Samsung Semiconductor K4F8E304HB-MGCJ is a high-performance DRAM (Dynamic Random Access Memory) chip that is part of Samsung%27s extensive portfolio of memory solutions. This specific model is designed to meet the demands of various applications, including mobile devices, consumer electronics, and computing systems. Below is a detailed overview of its specifications, features, and applications.

### Overview

The K4F8E304HB-MGCJ is a 4Gb (gigabit) DDR3 SDRAM (Double Data Rate Synchronous Dynamic Random Access Memory) device. It is optimized for low power consumption and high-speed performance, making it suitable for modern electronic devices that require efficient memory solutions.

### Key Specifications

1. Memory Density:
- The K4F8E304HB-MGCJ has a density of 4Gb, which allows for substantial data storage capacity in a compact form factor.

2. Organization:
- The memory is organized as 512M x 8 bits, meaning it has 512 million memory locations, each capable of storing 8 bits of data.

3. Operating Voltage:
- The device operates at a supply voltage of 1.5V, which is standard for DDR3 memory, ensuring compatibility with a wide range of systems while maintaining low power consumption.

4. Data Rate:
- The K4F8E304HB-MGCJ supports data rates of up to 1600 MT/s (megatransfers per second), allowing for high-speed data transfer and efficient performance in applications.

5. Package Type:
- The memory chip is available in a 78-ball FBGA (Fine Ball Grid Array) package, which provides a compact footprint and facilitates easy integration into various circuit designs.

6. Temperature Range:
- The operating temperature range for this memory chip is typically from -40°C to +85°C, making it suitable for industrial and automotive applications where temperature fluctuations may occur.

7. Latency:
- The device features a CAS latency (Column Address Strobe latency) of 11, which indicates the number of clock cycles required to access a specific column of data in the memory array.

8. Refresh Rate:
- The K4F8E304HB-MGCJ requires periodic refresh cycles to maintain data integrity, with a refresh rate of 64ms.

9. I/O Voltage:
- The I/O voltage is typically 1.5V, which is compatible with most DDR3 memory controllers.

### Features

- Low Power Consumption: The K4F8E304HB-MGCJ is designed for low power operation, making it ideal for battery-powered devices and applications where energy efficiency is critical.
- High Speed: With support for data rates up to 1600 MT/s, this memory chip provides fast access to data, enhancing overall system performance.
- Reliability: Samsung%27s advanced manufacturing processes ensure high reliability and durability, making this memory suitable for a wide range of applications.
- Compatibility: The DDR3 interface allows for easy integration with existing systems and components, ensuring broad compatibility across various platforms.

### Applications

- Mobile Devices: The K4F8E304HB-MGCJ is commonly used in smartphones and tablets, where high-speed memory is essential for smooth operation and multitasking.
- Consumer Electronics: This memory chip is suitable for use in televisions, gaming consoles, and other consumer electronics that require fast data processing.
- Computing Systems: The device can be utilized in laptops and desktop computers, providing the necessary memory performance for demanding applications.
- Industrial Applications: With its wide operating temperature range, the K4F8E304HB-MGCJ is ideal for industrial equipment and automotive systems that require reliable memory solutions.

### Conclusion

The Samsung Semiconductor K4F8E304HB-MGCJ is a versatile and high-performance DDR3 SDRAM chip that meets the demands of modern electronic devices. With its impressive specifications, including a 4Gb density, low power consumption, and high data rates, it is well-suited for a variety of applications ranging from mobile devices to industrial systems. When selecting memory solutions, it is essential to consider the specific requirements of the application to ensure optimal performance and reliability.

K4F8E304HB-MGCJ Stock: 17870

History Price
$6.50000
Certificates
5.0 / 5.0
review stars
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Léonie Caron
Location Icon France
5 stars
2021-08-02 07:24
Felt marking on the packaging not very readable (confusion possible ) ! Without that, conform! Thank you seller!
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Danuta Krawczyk
Location Icon Poland
5 stars
2021-08-12 12:06
IGBT transistors not detected SA for testerach beside plus t7-h, in tescie for przelaczanie with-12V for E plus zarowka powered + 12V for C triggered finger with Plus, zalancza with-wylancza. Very fast wysylka, fast delivery, product good jakosci, very we
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Charles Reed
Location Icon United States
5 stars
2021-12-31 23:06
Good product and work correctly .
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Quentin Giraud
Location Icon France
5 stars
2021-07-09 02:45
Well received, not tested yet
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Jukka Laakso
Location Icon Finland
5 stars
2021-12-03 00:22
I order 10pcs. Now test three chips and two was ID 0x441, wich is STM32F412, not STM32F407. I am wery disapointed.

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